IFP packaging, packaging, shrink wrap packaging technology
IFP Packaging has, for more than 25 years, provided a strong reference point for shrink wrap packaging technology. Since it joined the Tecno Pack S.p.A. group in 2011, it has embarked on a new path of technological, commercial, and industrial development. The company produces continuous electronic packaging machines that are built on entirely cantilevered structures
First compostable electrostatic dissipating anti-corrosion film in the world!
Breakthrough Packaging Technology for Electronics Industry EcoCortec is pleased to announce the world’s first Eco-Corr Film ESD – biodegradable, compostable static dissipative films and bags powered by “Nano” VpCI. This latest film technology is targeted mainly for electronics, telecommunications, packaging, and electric car industries seeking environmentally friendly packaging solutions. In anticipation of new EU regulations